A miniature grid array socketing system is provided having a socket 10 having a footprint corresponding to the footprint of an I.C. package 40 and/or of an adaptor 50. The contact pins 52 of the adaptor mate with socket contacts 23 mounted in passages of the socket. The adaptor has mounted thereto an I.C. package 40. For example, a ball grid array package having a 20 x 20 array on .050 x .050 inch spacing may be mounted on an adaptor which is mounted to a socket having corresponding .060 inch x. 060 inch spacings. The socket contacts are inspectable from above the passages of the socket and without any real estate penalty from the surface mount socket. Interconnected socket contacts are made on a larger spacing than required, which is then reduced by corrugation.