Signal communication paths between multiple chips are established through inter-chip electromagnetic coupling, thereby potentially eliminating mechanical inter-chip contacts and increasing inter-chip interconnection capacity while maximizing chip real estate allocated to a circuit layer. In one embodiment, multiple chips each include a conductive layer, disposed over a circuit layer (304) on a substrate (306), divided into electromagnetic coupling device elements such as capacitor plates (308). When utilizing capacitor plates (308), chips (302) are arranged face-to-face with opposing chips (314) having mirror image capacitor plate patterns to form a plurality of capacitors. Conventional signal transmission circuits produce time-varying signals which propagate to conventional signal receiving circuits of another chip via an embodiment of electromagnetic signal communication paths formed by the capacitors.