This invention relates to the field of integrated circuits. An integrated circuit (IC) having a plurality of IC modules, each IC module having attachment surfaces to which elements of the IC are attached, and each IC module having interlocking edges adjacent to the attachment surface. The interlocking edges of adjacent IC modules are interlocked to form a structural connection between the IC modules. The interlocking edges are a plurality of teeth and recesses, which are arranged in rows. The teeth are securely received by a respective recess in an adjacent interlocking edge to create a structural connection between adjacent IC modules. The elements on the IC modules communicate using external pathways and/or internal pathways. Using this configuration, an IC can be constructed that utilizes less real estate, fits in non-planar spaces in housing, and has improved speed due to reduced pathway lengths.