The present invention provides a clamping mechanism (50) intended primarily for LGA connectors that is light weight and has a low profile. The clamping mechanism (50) can be attached with pick-and-place assembly equipment, is reworkable at the factory, and no longer requires mounting holes drilled in corresponding circuit members. This improves wirability in the circuit member and allows for components (32) to be attached to the surface of the circuit members (24) opposite the clamping mechanism, thus reclaiming valuable real estate. The clamping mechanism also provides a controlled and uniform displacement of force over an array of contact members and avoids coefficient of thermal expansion mismatch problems.