An on-chip signal filter (200) uses bond wires as well as wire traces connecting IC bond pads to form inductive elements for the signal filter (200). The bond wires and/or traces can be configured in a plurality of ways to formulate different filter types including band pass, low pass, high pass, matching, and notch filters, among others. The bond wires and traces provide sufficiently high Q such that when used in combination with on-chip and/or off-chip capacitors, yield energy efficient filter architectures that conserve integrated circuit real estate.