A conductive adhesive, a raw material composition, an electronic element, and a preparation method and application. The raw material composition comprises the following components : a polymer elastomer resin, conductive particles, and hot melt adhesive powder. The mass ratio between the polymer elastomer resin and the hot melt adhesive powder is (4-17) : (3-35); the polymer elastomer resin is a polymer elastomer resin that is initiated to be cross-linked by peroxides; and a softening point of hot melt adhesive in the hot melt adhesive powder is higher than 90癈.